
High Layer For Torso Domain Control/AI Computing Module
· 8–30+ layer builds · Ultra-high wiring density & signal integrity · Mechanical through-hole / back-drilling (optional laser micro-via / HDI build-up zones) ·…
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· 8–30+ layer builds · Ultra-high wiring density & signal integrity · Mechanical through-hole / back-drilling (optional laser micro-via / HDI build-up zones) ·…
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· 4–16 layer typical (Any-layer up to 10+N) · Ultra-fine pitch BGA fan-out & compact routing · Laser micro-via (≤0.15 mm) / stacked &…
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· Rigid substrate + flexible polyimide layers · 3D interconnection · Foldable & lightweight · For wearable devices / medical implants / automotive electronics…
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· Polyimide base film · Roll-to-roll processing · Dynamic flexing & ultra-thin profile · For display modules / camera modules / battery management flex…
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· Aluminum / copper / stainless-steel core · Dielectric prepreg layer · Superior thermal dissipation · For high-power LED lighting / power modules /…
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· RF-optimized & ultra-low-loss hybrid materials · Controlled impedance / low insertion-loss routing · Laser micro-via HDI & cavity options · For automotive ADAS…
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