
HDI
· 4–16 layer typical (Any-layer up to 10+N) · Ultra-fine pitch BGA fan-out & compact routing · Laser…
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· Polyimide base film · Roll-to-roll processing · Dynamic flexing & ultra-thin profile · For display modules / camera modules / battery management flex / hinged device interconnection
· Polyimide base film · Roll-to-roll processing · Dynamic flexing & ultra-thin profile · For display modules / camera modules / battery management flex / hinged device interconnection
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