HDI

· 4–16 layer typical (Any-layer up to 10+N) · Ultra-fine pitch BGA fan-out & compact routing · Laser micro-via (≤0.15 mm) / stacked & staggered blind-via / buried-via · 1+N+1 / 2+N+2 / 3+N+3 / ELIC (Any-layer) build-up · For smartphone mainboards / wearable modules / AR-VR optics / automotive ADAS ECU / RF front-end & mmWave modules

Product Information

• Supplier Qualification: ISO 9001 / IATF 16949 audited · In-house CO₂ / UV laser drilling & sequential lamination · 100% flying-probe / fixture E-test / AOI / cross-section & copper-fill integrity per lot
• Technical Specification: Laser micro-via registration <±50 µm · Line/space 40/40 µm to 25/25 µm (ELIC grade) · Impedance tolerance ±7% · Via reliability ≥1000 thermal cycles (JEDEC) · Operating –40 to +150 °C (automotive grade available) · Low-Dk / low-CTE RCC / ABF / SLP materials (Ajinomoto, Panasonic, ITEQ)
• Available Documents: CE / RoHS / REACH · IPC-6016 / IPC-2226 HDI qualification records · Micro-section & fill-ratio reports / TDR impedance report / thermal-shock & HAST data · UL / IATF PPAP / EN 10204 3.1 certs (+AEC-Q100 alignment for automotive)