High Layer For Torso Domain Control/AI Computing Module

· 8–30+ layer builds · Ultra-high wiring density & signal integrity · Mechanical through-hole / back-drilling (optional laser micro-via / HDI build-up zones) · For AI server accelerator cards / telecom base-station backplanes / high-speed switches / medical imaging compute boards / semiconductor test & wafer-handling controllers

Product Information

• Supplier Qualification: ISO 9001:2015 audited · In-house multilayer lamination, drilling, plating & impedance control · 100% electrical test / AOI / micro-section & thermal stress validation per panel or per unit as specified
• Technical Specification: Layer-to-layer registration <±75 µm · Impedance tolerance ±8% · Via reliability ≥500 thermal cycles · Operating –40 to +125 °C (material-dependent) · High-Tg / low-Dk / low-loss FR-4, Megtron / Tu series, or PTFE hybrid stacks available
• Available Documents: CE / RoHS / REACH · IPC-6012 / IPC-4101 / IPC-2221 design & qualification records · TDR impedance report / thermal-cycle & micro-section reports / IEC 61000-4 EMC test reports where system-applied / EN 10204 3.1 material certs (+UL / EAC / KC per destination)